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Home On-Chip Actuation of an In-Plane Compliant Bistable Micromechanism

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On-Chip Actuation of an In-Plane Compliant Bistable Micromechanism

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Permanent URL	http://hdl.lib.byu.edu/1877/1156
Title	On-Chip Actuation of an In-Plane Compliant Bistable Micromechanism
BYU Creator	Baker, Michael S. Howell, Larry L.
Keywords	Bistable; compliant mechanism; micro relay; micro switch; pseudo-rigid-body model; thermal actuator
Description/Abstract	A compliant bistable micromechanism has been developed which can be switched in either direction using on-chip thermal actuation. The energy storage and bistable behavior of the mechanism is achieved through the elastic deflection of compliant segments. The Pseudo-Rigid-Body Model was used for the compliant mechanism design, and for analysis of the large deflection flexible segments. To achieve on-chip actuation, the mechanism design was optimized to allow it to be switched using linear motion thermal actuators. The modeling theory and analysis are presented for three design iterations, with two iterations fabricated in the MUMP's process and the third in the SUMMiT process.
Source	Baker, M.S. and Howell, L.L., â€œOn-Chip Actuation of an In-Plane Compliant Bistable Micromechanism,â€ Journal of Microelectromechanical Systems, Trans. IEEE and ASME, Vol. 11, No. 5, pp. 566-573, 2002.;
Publisher	IEEE
Date Original	2002-12-10
Language	English eng en
Publication Type	Articles
Type	Text
Format	application/pdf
Owning Institution	Brigham Young University
BYU College	Ira A. Fulton College of Engineering and Technology
BYU Department	Mechanical Engineering
Copyright Status	(c) 2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.;
Copyright Use Information	http://www.lib.byu.edu/generic_copyright.html

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